Category: Chipset

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AMD Featured

Nothing Phone (2) India Launch Via Flipkart: Leaked Specs And Availability

Key Highlights

  • Nothing Phone (2) will be released in the US in summer 2023
  • The smartphone is anticipated to be released in India
  • The Nothing Phone (2) is expected to feature a snapdragon 8+ Gen 1 processor

Nothing, the newest hype brand from OnePlus has gained attention ever since it launched. The transparent and luminating Nothing Phone (1) was the company’s first effort at a smartphone. However, everyone is now anticipating its successor and wondering what to anticipate from the Nothing Phone (2). Well, given that Nothing Phone (2) has been publicly teased and is forthcoming, we might not have to wait too long. Let’s examine every aspect in depth.

Also Read: Amazon Great Summer Sale Offers: Top Five Snapdragon 5G Phones Available With Heavy Discounts Under Rs. 30,000

Nothing Phone 2: Expected Specs

ModelExpected Specs
Display6.55-inch
Camera50MP
Battery5,000mAh
ChipsetSnapdragon 8+ Gen 1 SoC
RAM8GB/12GB

The Nothing Phone 2 is anticipated to have considerable improvements over its predecessor and top-notch specifications based on official teasers. The Nothing Phone (2) is expected to feature a 6.55-inch AMOLED screen with FHD+ resolution and a refresh rate of 120 Hz. It is expected to have a 50MP primary camera with OIS and two additional sensors. The 5,000mAh battery in the Nothing Phone (2) is expected to offer both fast wired and wireless charging.

The phone will be powered by a Snapdragon 8+ Gen 1 SoC. The Glyph Interface used by the firm for alerts on the Nothing Phone 1 is anticipated to remain in the Nothing Phone 2’s design. A frame made of aluminum will be inserted between the glass front and back panels.

The upcoming handset will be available in three variants. The base variant will have 8GB of RAM and 128GB of storage. The second variant will have 8GB of RAM and 256GB of storage, with the top-of-the-line variant said to feature 12GB of RAM and 256GB of storage. 

Also Read: Flipkart’s Big Saving Days Sale 2023: Huge Discounts On Popular Smartphones

Nothing Phone 2: Expected Launch

India will be among the first nations to receive the Nothing Phone (2), and the business intends to increase production there. Additionally, the phone was recently discovered with the model number AIN065 on the BIS certification website, indicating an impending introduction. The Nothing Phone (2) will be sold in India through Flipkart, the same as the Phone (1).

Also Read: Amazon Summer Sale Offers: Best Deals To Grab On 43-inch Smart TVs

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Chipset Comparison Featured

MediaTek Dimensity 7050 Vs Qualcomm Snapdragon 888 Chipset Comparison: Best Mobile Processor For Power Performance

Key Highlights

  • Popular: MediaTek Dimensity 7050, Qualcomm Snapdragon 888.
  • Snapdragon 888: faster CPU, GPU than Dimensity 7050.
  • Unique features suit diverse user needs.

With constant innovation and upgrades in technology, there are numerous chipsets available in the market. MediaTek Dimensity 7050 and Qualcomm Snapdragon 888 are two of the most popular mobile processors in the market today. In this article, we will compare the two processors in terms of their CPU architecture, GPU performance, memory, and multimedia capabilities.

ChipsetMediaTek Dimensity 7050Qualcomm Snapdragon 888
CPUOcta-coreOcta-core
GPUArm Mali-G68 MC4Adreno 660
MemoryLPDDR4X, LPDDR5LPDDR5
RAM Speed2666 MHz3200 MHz
Fabrication6nm5nm

Also Read: MediaTek Dimensity 7200 Vs Qualcomm Snapdragon 870 Premium Mobile Processor Comparison: CPU, GPU, Memory, And More

MediaTek Dimensity 7050 Vs Qualcomm Snapdragon 888 Chipset: Fabrication, CPU Architecture

MediaTek Dimensity 7050 is fabricated on 6nm process technology, while Qualcomm Snapdragon 888 is fabricated on a more advanced 5nm process technology, making it more power-efficient.

The Dimensity 7050 features an octa-core CPU with a 2+6 configuration, with two powerful Cortex-A78 cores running at 2.8 GHz and six Cortex-A55 cores running at 2.0 GHz. In contrast, the Snapdragon 888 features an octa-core CPU with a 1+3+4 configuration with a powerful Kryo 680 core running at 2.84 GHz.

The Snapdragon 888’s CPU architecture is superior to the Dimensity 7050 due to its faster clock speeds and more powerful cores. However, the Dimensity 7050’s configuration is optimized for power efficiency and delivers better battery life.

Also Read: MediaTek Dimensity 9000 Vs Qualcomm Snapdragon 870 Processor: Best Chipset For Value Flagship

MediaTek Dimensity 7050 Vs Qualcomm Snapdragon 888 Chipset: GPU Comparison

The GPU is another essential aspect of a mobile processor. The Dimensity 7050 features an Arm Mali-G68 MC4 GPU, while the Snapdragon 888 features an Adreno 660 GPU.

The Adreno 660 GPU is more powerful than the Mali-G68 MC4 and delivers better graphics performance. The Snapdragon 888 can handle high-end games and intensive graphics tasks with ease.

Also Read: Qualcomm Snapdragon 888 Vs MediaTek Dimensity 1300 Chipset Quick Comparison

MediaTek Dimensity 7050 Vs Qualcomm Snapdragon 888 Chipset: Memory, Multimedia (ISP) Comparison

When it comes to memory, Dimensity 7050 support LPDDR4X and LPDDR5 RAM whereas Snapdragon 888 supports only LPDDR5 RAM. However, the Snapdragon 888 supports faster RAM speeds of up to 3200 MHz, while the Dimensity 7050 only supports RAM speeds of up to 2666 MHz.

In terms of multimedia, both chipsets feature powerful image signal processors (ISPs). The Dimensity 7050 supports up to a 200 MP camera and can record 4K videos at 60fps. The Snapdragon 888, on the other hand, also supports up to a 200 MP camera but can record 8K videos at 30fps.

Also Read: Best MediaTek-Powered Gaming Phones Under Rs. 20,000 In India

MediaTek Dimensity 7050 Vs Qualcomm Snapdragon 888 Chipset: Final Verdict

Both the MediaTek Dimensity 7050 and Qualcomm Snapdragon 888 are powerful mobile processors. The Snapdragon 888 is more powerful when it comes to CPU and GPU performance, but the Dimensity 7050 delivers better power efficiency and better battery life.

Also Read: MediaTek Helio G36 Vs Qualcomm Snapdragon 480 Entry-Level Gaming Chipset Comparison

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Chipset Featured Info

MediaTek Dimensity 7050 New Premium Mid-Range 5G Chipset Launched Discreetly: Expected Phones To Use This New SoC

Key Highlights

  • MediaTek Dimensity 7050 launched as new premium mid-range 5G processor
  • Essentially the rebadged Dimensity 1080 processor
  • Has octa-core CPU and Mali G68-MC4 GPU
  • To power upcoming Realme 11 Pro 5G

MediaTek is gradually increasing its presence across the mobile chipset market. The brand’s Dimensity series chipsets has been giving some tough time to the widely popular Snapdragon mid-range and flagship processors. The brand has now secretly added the Dimensity 7050, a new 5G chipset for value flagship phones. What all are the specs of the latest MediaTek Dimensity 7050 mobile processor and which all smartphones can we expect this SoC to power going forward? Let’s dive into the details below:

Also Read: http://dimensityQualcomm Snapdragon 780G Vs MediaTek Dimensity 8200 5G: Best Future Ready Gaming Chipset Comparison

MediaTek Dimensity 7050 Chipset: Key Specifications

MediaTek Dimensity 7050Key Specs
CPUOcta-core (two 2.6GHz Cortex-A78+ Six 2.0GHz Cortex-A55 Cores)
GPUMali-G68 MC4 GPU
TSMC6nm
MemoryLPDDR5/ LPDDR4X
StorageUFS 2.1, UFS 3.1

The MediaTek Dimensity 7050 processor as mentioned above is designed to power premium mid-range Android smartphone. But there’s a catch. The Dimensity 7050 isn’t an entirely new mobile processor. MediaTek has essentially rebadged the Dimensity 1080 mobile chipset as the Dimensity 7050 SoC. In fact, the chip making giant is reportedly planning to refresh its portfolio with rebadged Dimensity 6000 and Dimensity 7000 mobile processors.

The new Dimensity 7050 processor along with the upcoming ones will only feature a renewed moniker. The spec-sheet will be identical to the existing versions. Speaking of which, the newly introduced Dimensity 7050 mobile processor has been constructed on the same TSMC 6nm fabrication process and has an octa-core CPU. MediaTek suggests a boosted gaming performance with the new Dimensity chipset.

The CPU core cluster on the Dimensity 7050 includes dual high-performance Cortex-A78 cores with 2.6GHz clock speed and six-power efficient Cortex-A55 cores with 2.0GHz clock speed. The Dimensity 7050 has the Mali-G68 MC4 GPU instilled which is the same as the Dimensity 1080 5G processor.

In addition to this, the Dimensity 7050 has LPDDR5 and LPDDR4x memory compatibility. The storage support is UFS 2.1 and UFS 3.1 with the latest Dimensity 7000 series chipset. The additional features offered by the latest Dimenisty 7050 processor are 1080 x 2520 pixels max display resolution, up to 200MP camera support, up to 4K@ 30 fps video encoding, and playback support.

Also Read: MediaTek Dimensity 9200+ 5G Chipset Official Launch Tipped Later This Year: Most Powerful MediaTek Mobile Processor Till Date?

Expected Phones To Be Launched With Dimensituy 7050 Processor?

If we believe the rumors, the MediaTek Dimensituy 7050 chipset will be powering the upcoming Realme 11 Pro. Since this is a premium mid-range chipset, we can expect multiple other handsets from popular OEMs such as Samsung, OPPO, and Vivo to use this re-designed Dimensity 5G processor in their future models.

Also Read: MediaTek Dimensity 7200 Vs Qualcomm Snapdragon 870 Premium Mobile Processor Comparison: CPU, GPU, Memory, And More

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Chipset Comparison Featured

MediaTek Dimensity 7200 Vs Qualcomm Snapdragon 870 Premium Mobile Processor Comparison: CPU, GPU, Memory, And More

Key Highlights

  • Latest and most powerful mobile processors – MediaTek Dimensity 7200 vs Qualcomm Snapdragon 870.
  • Detailed comparison of CPU, GPU, memory, and multimedia capabilities.

This article will focus on two of the latest and most powerful mobile processors in the market – the MediaTek Dimensity 7200 and the Qualcomm Snapdragon 870. Both processors are designed to cater to the high-end mobile device segment, offering top-notch performance and advanced features.

ChipsetMediaTek Dimensity 7200Qualcomm Snapdragon 870
CPUOcta-coreOcta-core
GPUMali-G610 MC4Adreno 650
MemoryLPDDR5LPDDR5
StorageUFS 3.0UFS 3.0 and UFS 3.1
Fabrication4nm7nm

MediaTek Dimensity 7200 Vs Qualcomm Snapdragon 870 Processor: CPU Architecture

The MediaTek Dimensity 7200 features a 4nm manufacturing process and an octa-core CPU that includes two two ARM Cortex-A715 cores clocked at 2.8 GHz and six Cortex-A510 cores clocked at 2.0 GHz.

On the other hand, the Qualcomm Snapdragon 870 features a 7nm manufacturing process and an octa-core CPU that includes 3.2GHz Kryo 585 Prime core, three 2.42GHz Kryo 585 Gold cores, and four 1.80GHz Kryo 585 Silver cores. The Qualcomm Snapdragon 870 has faster clock speeds than the MediaTek Dimensity 7200.

Also Read: MediaTek Dimensity 9000 Vs Qualcomm Snapdragon 870 Processor: Best Chipset For Value Flagship

MediaTek Dimensity 7200 Vs Qualcomm Snapdragon 870 Processor: GPU Comparison

The GPU is responsible for handling the graphics processing of a device. The MediaTek Dimensity 7200 features a Mali-G610 MC4 GPU, while the Qualcomm Snapdragon 870 features an Adreno 650 GPU. The Adreno 650 GPU is known for its powerful graphics capabilities and is often considered one of the best mobile GPUs in the market. While the Mali-G610 MC4 is a capable GPU, it may not be able to match the performance of the Adreno 650.

Also Read: Qualcomm Snapdragon 780G Vs MediaTek Dimensity 8200 5G: Best Future Ready Gaming Chipset Comparison

MediaTek Dimensity 7200 Vs Qualcomm Snapdragon 870 Processor: Memory, Multimedia (ISP) Comparison

The MediaTek Dimensity 7200 supports LPDDR5 RAM and UFS 3.1 storage, while the Qualcomm Snapdragon 870 supports LPDDR5 RAM and UFS 3.0 & 3.1 storage. Both processors are capable of handling high-speed memory and storage solutions, but the MediaTek Dimensity 7200 has a slight edge in this category with support for UFS 3.1 storage.

In terms of multimedia capabilities, the MediaTek Dimensity 7200 features a 32MP+32MP dual-camera setup and can support up to a 200MP single-camera sensor. The Qualcomm Snapdragon 870, on the other hand, features a triple-camera setup that can support up to a 200MP single-camera sensor 25MP+25MP dual-camera . While both processors are capable of supporting high-end camera sensors, the MediaTek Dimensity 7200 has better camera setup.

Also Read: Best MediaTek-Powered Gaming Phones Under Rs. 20,000 In India

MediaTek Dimensity 7200 Vs Qualcomm Snapdragon 870 Processor: Final Verdict

Both the MediaTek Dimensity 7200 and Qualcomm Snapdragon 870 are powerful and capable processors that can handle demanding tasks with ease. However, the Snapdragon 870 has a slight advantage in terms of CPU architecture and GPU performance, while the MediaTek Dimensity 7200 has an edge in terms of storage solutions. It ultimately comes down to personal preferences and the specific requirements of the device.

Whether you choose the MediaTek Dimensity 7200 or Qualcomm Snapdragon 870, you can rest assured that you will be getting a high-quality and reliable processor for your premium mobile device.

Also Read: MediaTek Dimensity 8200 VsQualcomm Snapdragon 870: Best 5G Chipset For Value Flagships

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Chipset Featured Leaks

Qualcomm Snapdragon 8 Gen 3 More Details Leaked: New CPU, GPU To Improve Performance Efficiency

Key Highlights

  • Qualcomm Snapdragon 8 Gen 3 SoC in works
  • Qualcomm to use either 4nm TSMC or 3nm Samsung fabrication process for SD 8 Gen 3
  • CPU will comprise 2+3+2+1 core clusters

Qualcomm is set to launch its latest generation flagship mobile chipset called the Snapdragon 8 Gen 3. This new mobile processor will be arriving as a successor to the Snapdragon 8 Gen 2 mobile SoC and will be coming along with several upgrades and will offer improved CPU and GPU efficiency. Recently, one of the leaks revealed a different architecture of the Snapdragon 8 Gen 3 compared to the Snapdragon 8 Gen 2 SoC. Now, a fresh leak has emerged that reveals the core architecture design of the Qualcomm’s most flagship mobile chipset.

Also Read: MediaTek Dimensity 9000 Vs Qualcomm Snapdragon 870 Processor: Best Chipset For Value Flagship

Qualcomm Snapdragon 8 Gen 3 Mobile Processor Clock Frequency Revealed

Qualcomm Snapdragon 8 Gen 3Specifications (Expected)
CPU2+3+2+1 architecture
GPUAdreno 750 GPU
FabricationTSMC 4nm or Samsung 3nm
Expected LaunchNA

A new report by IT Home gives us an insight into the upcoming Snapdragon 8 Gen 3 mobile chipset’s core cluster design and the clock frequency. According to the report, the Qualcomm Snapdragon 8 Gen 3 flagship mobile processor will be featuring a 2+3+2+1 CPU core clusters. This is a unique CPU cluster design that Qualcomm will be using for its next high-end mobile chipset and has been tipped earlier as well.

Also Read: Qualcomm Snapdragon 780G Vs MediaTek Dimensity 8200 5G: Best Future Ready Gaming Chipset Comparison

This new leak suggests that Qualcomm will be using the 2 ARM “Silver” cores codenamed “Hayes” (A5xx), 3 ARM “gold” cores named “Hunter” (A7xx), and 2 ARM “titanium” cores codenamed Hunter (A7xx), and 1 ARM “gold+” core with “Hunter ELP” (Xn).

In addition to this the report further suggests that the latest flagship Qualcomm Snapdragon 8 Gen 3 mobile chipset will come void of 32-bit Android app compatibility. This is primarily due to the fact the required CPUs for 32-bit Android apps are removed from the new-gen processor. Instead, the Qualcomm Snapdragon 8 Gen 3 SoC will support 64-bit architecture. This would need the app developers to release app with 64-bit support.

If we speak of the remaining specs and features, the Qualcomm Snapdragon 8 Gen 3 mobile processor is said to come with Adreno 750 GPU support. This is one of the other major upgrades that the SD 8 Gen 3 comes with compared to the previous gen models. This GPU has 779MHz clock speed as per the leaks. Furthermore, Qualcomm could use either an enhanced 4nm TSMC process or Samsung 3nm process to design the Snapdragon 8 Gen 3 mobile chipset.  

Also Read: Qualcomm Snapdragon Vs MediaTek – Which One Is Better? Pros, Cons And More

Qualcomm Snapdragon 8 Gen 3 Premium Mobile Gaming Chipset Launch Date, Expected Smartphones

Both launch timeline and the expected list of smartphones to debut first with the Snapdragon 8 Gen 3 mobile processor are not confirmed. Qualcomm might take a while to bring this chipset officially in the global markets and the expected names of smartphones powered by Qualcomm’s this premium processor will be revealed then.

Also Read: Qualcomm Snapdragon 782G Vs Dimensity 920 SoC Premium Mid-Range Mobile Chipset Comparison

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Chipset Featured

MediaTek Dimensity 9200+ 5G Chipset Official Launch Tipped Later This Year: Most Powerful MediaTek Mobile Processor Till Date?

Key Features

  • MediaTek Dimenisty 9200+ SoC in works
  • Will be an up-scaled version of Dimenisty 9200 SoC
  • Will use 4nm TSMC fabrication process

MediaTek is set to launch a new Dimensity series mobile chipset. The next offering from the brand will is said to be the most powerful SoC that will be announced this year. A new leak has now emerged detailing the core features of the upcoming MediaTek Dimensity 9200+ mobile processor. Here’s what all we can expect from MediaTek’s most premium 5G mobile chipset:

Also Read: Best Smartphones To Purchase In India With The MediaTek Dimensity 700 Processor

MediaTek Dimensity 9200+ SoC Key Features

MediaTek Dimensity 9200+Key Features
CPUOcta-core (1+2+4 cluster)
GPUImmortalis series GPU
Fabrication4nm TSMC
Launch dateLater half of 2023

The MediaTek Dimensity 9200+ processor will be making its debut as a successor to the Dimensity 9200 and will come with some noticeable upgrades in terms of performance delivery. Popular tipster Digital Chat Station has leaked the details related to the next flagship-grade 5G mobile chipset from MediaTek.

Also Read: Qualcomm Snapdragon 778G Vs MediaTek Dimensity 900 Chipset Quick Comparison

As per the leak, the MediaTek Dimenisty 9200+ processor will also feature an octa-core CPU cluster as the standard Dimensity 9200 chipset. However, the new chipset will offer an increased CPU frequency compared to the current-gen variant. It is expected that the Dimensity 9200+ mpbile chipset will also feature a 1+2+3 core cluster design similar to the standard Dimensity 9200 SoC.

Also Read: Qualcomm Snapdragon 7 Gen 1 Vs MediaTek Dimensity 1080 Chipset: Best Premium Mid-Range Mobile Chipset Released In 2022

According to the reports, the Dimensity 9200+ will feature one large core that could possibly offer over 3.05GHz clock speed. The remaining core details are yet to be revealed. Just to recap, the standard Dimensity 9200 mobile processor’s 1+3+4 CPU cluster includes one Cortex-X2 core with up to 3GHz clock speed, three Cortex-A710 cores with up to 2.85GHz clock speed, and four Cortex-A510 cores with up to 1.8GHz clock speed.

It remains to be seen what major upgrades the Dimensity 9200+’s core cluster will have compared to the standard version. Also, the GPU integrated with the vanilla Dimensity 9200 chipset is Immortalis-G715 GPU. We can expect an upscaled Immortalis GPU integrated inside the Dimensity 9200+ 5G chipset. Furthermore, a 4nm TSMC process is said to be used for the fabrication process of the Dimensity 9200+ SoC.  

Also Read: Qualcomm Snapdragon 780G Vs MediaTek Dimensity 8200 5G: Best Future Ready Gaming Chipset Comparison

Dimensity 9200+ 5G Processor, Upcoming Phones, Expected Launch Timeline

The MediaTek Dimensity 9200+ 5G mobile chipset is said to be released in the second half of 2023. As mentioned above, the Dimenisty 9200+ SoC will be the most powerful chipset from MediaTek that will likely drive some of the top-tier Android flagships going forward. The primary rivals of the Dimensity 9200+ chipset will be the Snapdragon 8 gen series chipsets.

As for the phones expected to be powered by the Dimensity 9200+ chipset, brands like Vivo, Realme, Oppo, and others are expected to use this new high-end mobile processor from MediaTek. However, the exact model list is not available yet.

Also Read: MediaTek Dimensity 9000 Vs Qualcomm Snapdragon 870 Processor: Best Chipset For Value Flagship

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Chipset Featured Leaks

Qualcomm Snapdragon 8 Gen 3 Flagship Mobile Chipset Key Specs Leaked: Expected Mobiles Powered By SD 8 Gen 3

Key Highlights

  • Qualcomm Snapdragon 8 Gen 3 chipset leaked with 1+5+2 architecture
  • Adreno 750 GPU, UFS 4.1 storage tipped
  • Official launch timeline not confirmed yet

Qualcomm has been trying to stay ahead in the mobile chipset race with its top-of-the-line Snapdragon 8 Gen series SoCs. The brand has already introduced the Snapdragon 8 Gen 1, Snapdragon 8+ Gen 1, and the Snapdragon 8 Gen 2 chipsets in this lineup. Soon, the company plans to add the third-generation mobile processor in this high-end series called the Snapdragon 8 Gen 3. In the latest developments, the CPU architecture and more details of the next Snapdragon 8 Gen chipset has been leaked.

Also Read: MediaTek Helio G36 Vs Qualcomm Snapdragon 480 Entry-Level Gaming Chipset Comparison

Qualcomm Snapdragon 8 Gen 3 Mobile Chipset

Qualcomm Snapdragon 8 Gen 3Features
CPUSingle 3.2GHz core+ five Cortex A720 cores @ 3.0Ghz + two Cortex A520 cores with 2.0 GHz clock speed
GPUAdreno 750
StorageUFS 4.1
MemoryLPDDR5
Fabrication4nm N4P TSMC

Contrary topast reports that claimed the Snapdragon 8 Gen 3 will feature the same architecture as the Snapdragon 8 Gen 2, the latest report suggests a new CPU core layout. While the Snapdragon 8 Gen 2 offered a 1+4+3 core cluster design, the Snapdragon 8 Gen 3 is said to feature 1+5+2 CPU cluster. This new architecture design is said to allow the Snapdragon 8 Gen 3 SoC to offer improved CPU and GPU efficiency over the previous-gen Snapdragon 8 Gen series mobile chipsets.

Furthermore, the Snapdragon 8 Gen 3 SoC is rumored to pack at least one core with a 3.2Ghz of clock speed. The remaining core cluster is said to comprise five Cortex A720 cores with a clock speed of 3.0GHz and two CortexA520 cores with 2.0GHz clock speed. In addition to this new CPU cluster, the latest leaks also confirm the TSMC N4P fabrication process for the Snapdragon 8 Gen 3 chipset.

This information corroborate with the previous leaks indicating the same fabrication process as the SD 8 Gen 2. Some rumors also hint the use of an entirely different 3nm fabrication process for the SD 8 Gen 3. It seems that we will have to wait for a while to be sure of the exact fabrication design of the upcoming flagship Snapdragon 8 Gen 3 mobile SoC.

That said to of the CPU and fabrication, the Qualcomm Snapdragon 8 Gen 3 processor is said to be integrated with an Adreno 750 GPU which is a significant improvement over the Adreno 740 and Adreno 730 used by the Snapdragon 8 Gen 2 and the Snapdragon 8 Gen 1 respectively. The storage compatibility will likely be UFS 4.1, while the memory support expected is LPDDR5. The chipset will also include the Qualcomm X75 5G modem for faster 5G network speeds.

Also Read: Qualcomm Snapdragon 780G Vs MediaTek Dimensity 8200 5G: Best Future Ready Gaming Chipset Comparison

Smartphones Expected To Launch With Snapdragon 8 Gen 3

None of the smartphone brands have released the moniker of the expected models that will be driven by the Snapdragon 8 Gen 3 chipset. However, we can expect some of the names during this chipset’s official launch. Top-of-the-line handsets from Samsung, OnePlus, iQOO, and others will possibly be amongst the first to debut with the Snapdragon 8 Gen 3 chipset. We will share updates once available.

Also Read: MediaTek Dimensity 9000 Vs Qualcomm Snapdragon 870 Processor: Best Chipset For Value Flagship

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Chipset Comparison Featured

MediaTek Dimensity 9000 Vs Qualcomm Snapdragon 870 Processor: Best Chipset For Value Flagship

Key Highlights

  • MediaTek Dimensity 9000 and Qualcomm Snapdragon 870 are top chipsets for value flagship smartphones.
  • MediaTek Dimensity 9000 offers better raw performance with 4nm manufacturing process.
  • Qualcomm Snapdragon 870 has better GPU performance and more mature software optimizations.
  • Both chipsets offer good value for money with high-end performance and power efficiency.

In the world of smartphones, choosing the right chipset is crucial as it determines the overall performance of the device. Two of the most popular chipsets available in the market today are the MediaTek Dimensity 9000 and the Qualcomm Snapdragon 870. These two processors are known for being powerful, efficient, and most importantly, cost-effective. But which one is the better choice for a value flagship smartphone?

Let’s dive into the details and compare the two.

ChipsetMediaTek Dimensity 9000Qualcomm Snapdragon 870
CPUOcta-core Octa-core
GPUArm Mali-G710 MC10Adreno 650
Memory LPDDR5XLPDDR5
Storage UFS 3.1UFS 3.0 and UFS 3.1
Fabrication 4nm7nm
Also Read: MediaTek Dimensity 9000+ Premium Chipset Fuelled iQOO Neo 7’s Geekebench Scores Out

MediaTek Dimensity 9000 Vs Qualcomm Snapdragon 870 Processor: CPU Architecture

The MediaTek Dimensity 9000 is an 4nm octa-core processor that uses a 3.05GHz ultra-core ARM Cortex-X2, three 2.85GHz high-performance ARM Cortex-A710, and four 2.0GHz energy-efficient ARM Cortex-A510 cores. This setup ensures optimal performance while still being efficient on battery life.

On the other hand, the Qualcomm Snapdragon 870 is also a 7nm octa-core processor that uses a 3.2GHz Kryo 585 Prime core, three 2.42GHz Kryo 585 Gold cores, and four 1.80GHz Kryo 585 Silver cores. The Snapdragon 870’s CPU is powerful and efficient, making it perfect for a value flagship smartphone.

Out of both, the Dimensity 9000 processor has a better CPU architecture compared to the Snapdragon 870. 

Also Read: MediaTek Helio G36 Vs Qualcomm Snapdragon 480 Entry-Level Gaming Chipset Comparison

MediaTek Dimensity 9000 Vs Qualcomm Snapdragon 870 Processor: GPU Comparison

When it comes to gaming and graphics, the GPU is just as important as the CPU. The MediaTek Dimensity 9000 uses the world’s first Arm Mali-G710 MC10 GPU, which offers a 35% increase in performance compared to its predecessor, the Mali-G77.

On the other hand, the Qualcomm Snapdragon 870 uses the Adreno 650 GPU, which is also known for its exceptional performance. It’s important to note that the Adreno 650 has been used in other high-end Snapdragon processors, so it’s a proven and reliable option.

Also Read: Qualcomm Snapdragon 680 Vs MediaTek Helio G99 Chipset: Which Mid-Range SoC Fairs The Battle?

MediaTek Dimensity 9000 Vs Qualcomm Snapdragon 870 Processor: Memory, Multimedia (ISP) Comparison

The MediaTek Dimensity 9000 support LPDDR5X memory whereas Qualcomm Snapdragon 870 support LPDDR5 memory, both are efficient memory technology available today. However, the MediaTek Dimensity 9000 takes the lead with a better LPDDR5X memory and when it comes to multimedia capabilities. While Qualcomm has included support for both UFS 3.0 and UFS 3.1 storage, MediaTek has gone a step further by opting for exclusive support for the higher-performance UFS 3.1 storage technology, providing faster data transfer speeds and smoother app performance for users.

Further, MediaTek Dimensity 9000 has a powerful Image Signal Processor (ISP) with 32MP triple camera clubbed with 320-megapixel cameras, 4K HDR Video + AI-NR video recording and even 2X lossless zoom.

The Qualcomm Snapdragon 870, on the other hand, also has a powerful ISP that can support up to 200-megapixel cameras and 4K HDR video recording. However, the Dimensity 9000 chipset takes a lead here with 1 x 320MP and 3x32MP camera resolution support. 

Also Read: Qualcomm Snapdragon 780G Vs MediaTek Dimensity 8200 5G: Best Future Ready Gaming Chipset Comparison

MediaTek Dimensity 9000 Vs Qualcomm Snapdragon 870 Processor: Final Verdict

After comparing the MediaTek Dimensity 9000 and Qualcomm Snapdragon 870, it’s clear that both processors are excellent choices for a value flagship smartphone. The MediaTek Dimensity 9000 is an excellent option for users who prioritize multimedia capabilities, while the Qualcomm Snapdragon 870 is a reliable choice for overall performance.

Ultimately, the decision comes down to personal preference and what features you value the most. Both chipsets are capable of handling everyday tasks, multitasking, and gaming without any issues. It’s worth noting that the MediaTek Dimensity 9000 is a newer processor and might have some optimizations to come in the future.

In conclusion, the MediaTek Dimensity 9000 and Qualcomm Snapdragon 870 are both great options for a value flagship smartphone. They offer exceptional performance, energy efficiency, and multimedia capabilities, making them perfect for a wide range of users. With these two options available, users can be confident that they can find a powerful and cost-effective device that meets their needs.

Also Read: Qualcomm Snapdragon 782G Vs Dimensity 920 SoC Premium Mid-Range Mobile Chipset Comparison
Categories
Chipset Info

iQOO Z7, Z7x Chipset Details Leaked: Snapdragon 782, Snapdragon 695 SoC In Tow

Key Highlights

  • iQOO Z7, Z7x official launch in China soon
  • iQOO Z7 to use Snapdragon 782 chipset
  • iQOO Z7x will be powered by Snapdragon 695 SoC

iQOO is bringing new Z series phone for the masses. The company is gearing up for the iQOO Z7 and the Z7x launch in its home country China. iQOO might soon confirm the exact timeline for the Z7 series’ official launch in China. Meanwhile, the rumor mill has already started spilling beans on the upcoming iQOO Z7 and the Z7x hardware features. The latest leak has revealed the chipset details of both variants. Let’s dive into the details below:

Also Read: iQOO Neo 7 5G Vs OPPO Reno 8T 5G Full Comparison: Best Phone Under Rs. 30,000 In 2023

iQOO Z7, iQOO Z7x Chipset, Other Expected Hardware

ModeliQOO Z7iQOO Z7x
Display6.67-inch LCD, FHD+LCD FHD+
Camera50MP triple rearNA
ChipsetSnapdragon 782Snapdragon 695
Battery5,000 mAh6,000 mAh

Chinese tipster Bald Panda has shared a new leak that reveals the processors powering the vanilla iQOO Z7 and the iQOO Z7x. According to the leak, the standard iQOO 7 will be using the octa-core Snapdragon 782 chipset under its hood for power delivery, while the iQOO Z7x will be driven by the octa-core Snapdragon 695 SoC.

Also Read: iQOO Neo 6 Long Term User Review: Performance Beast In Its League

iQOO has used an upgraded processor to power the Z7 and the Z7x compared to their predecessors. For reference, the vanilla iQOO Z6 gets its power from the Qualcomm Snapdragon 778G, while the Z6x has the MediaTek Dimensity 810 SoC. The tipster has currently only confirmed the chipset details of the next-generation iQOO phones. Other details have been revealed by multiple certification portals and leaks.

Starting with the vanilla iQOO Z7, this model has made appearances online with the V2270A model number, while the iQOO Z7x has been spotted at mobile authentication platforms with the V2272A model number. Not much is known related to the iQOO Z7x’s features.

However, the vanilla Z7 is rumored to debut with a 6.67-inch display. The panel used will be LCD which we have seen with the previous-generation model. The standard iQOO 7 is further said to feature a triple-lens camera module including a 50MP+8MP+2MP setup. A 5,000 mAh battery unit is said to power the vanilla iQOO Z7, while the iQOO Z7x could be using a larger 6,000 mAh battery unit. Both models are expected to get 80W fast charging support.

Also Read: iQOO Z6 Pro 5G Long-Term User Review: Is It A Hit Or A Miss?

When Is iQOO Z7, Z7x Launching In India?

The iQOO Z7 series is initially making its debut in the Chinese market. The brand has not announced the availability details for the Indian market as of now. However, rumors suggest a March 21 launch timeline for the iQOO Z7 and the iQOO Z7x in the country.

Also Read: iQOO Z6 Pro 5G Vs OnePlus Nord CE 2 5G Vs Oppo F21s Pro: Best Mid-Range 5G Smartphone To Buy In India

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Chipset Comparison

Qualcomm Snapdragon 780G Vs MediaTek Dimensity 8200 5G: Best Future Ready Gaming Chipset Comparison

Key Highlights

  • Both chipsets offer integrated 5G modems.
  • Qualcomm Snapdragon 780G offers excellent gaming performance, efficient power consumption.
  • Dimensity 8200 5G leads Snapdragon 780G in CPU performance with higher clock speed.

As 5G connectivity becomes more widely available, the demand for powerful chipsets that can handle the latest mobile games and applications is also increasing. Qualcomm and MediaTek are two of the leading chipset manufacturers in the industry, with their Snapdragon 780G and Dimensity 8200 5G respectively competing for the top spot in the market. In this article, we will compare these two chipsets and determine which one is the best for future-ready gaming.

Also Read: MediaTek Helio G99 Vs Dimensity 700 Chipset Comparison: Best Budget Mobile Processor For Android Phones?

Qualcomm Snapdragon 780G Vs MediaTek Dimensity 8200 5G: CPU Architecture

The CPU architecture is an essential aspect of a chipset’s performance, and both Snapdragon 780G and Dimensity 8200 5G feature powerful architectures. The Snapdragon 780G is built on an 5nm process and features a Cortex-A78 CPU with a maximum clock speed of 2.4GHz. On the other hand, the Dimensity 8200 5G is built on a 4nm process and features a Cortex-A78 CPU with a maximum clock speed of 3.1GHz.

In terms of CPU performance, the Dimensity 8200 5G takes the lead due to its higher clock speed and smaller manufacturing process. However, both the chipsets are no slouch, as their Cortex-A78 CPU provides powerful CPU architectures that can handle demanding mobile applications and multitasking with ease.

Also Read: Snapdragon 780G: The economic SoC champion

Qualcomm Snapdragon 780G Vs MediaTek Dimensity 8200 5G: GPU Comparison

The GPU is another critical aspect of a chipset’s performance, particularly for gaming. The Snapdragon 780G features an Adreno 642 GPU, while the Dimensity 8200 5G features a Mali-G610 MC6 GPU.

While both GPUs are powerful, the Adreno 642 GPU in the Snapdragon 780G is considered superior due to its better optimization and support for advanced gaming and graphics technologies such as HDR and ray tracing. The Mali-G610 MC6 GPU also provides excellent performance in other multimedia applications such as video playback and image rendering, but it may not be as feature-rich as the Adreno 642.

Also Read: MediaTek Dimensity 8200 VsQualcomm Snapdragon 870: Best 5G Chipset For Value Flagships

Qualcomm Snapdragon 780G Vs MediaTek Dimensity 8200 5G: Memory, Multimedia (ISP) Comparison

Memory and multimedia capabilities are also important factors to consider when comparing chipsets. The Snapdragon 780G supports LPDDR4X RAM up to 16GB, while the Dimensity 8200 5G supports LPDDR RAM up to 12GB.

In terms of multimedia, the Snapdragon 780G features a Spectra 570 Triple ISP, while the Dimensity 8200 5G features a MediaTek Imagiq 785 ISP. The Spectra 570 Triple ISP is known for its excellent image processing capabilities and supports up to three 25MP camera sensors. The Imagiq 785 ISP, on the other hand, supports up to 320MP camera sensors and features advanced AI-based image processing.

Overall, both chipsets offer excellent memory and multimedia capabilities, with the Snapdragon 780G slightly ahead in terms of memory speed and the Dimensity 8200 5G offering better image processing.

Also Read: MediaTek Dimensity 7200 Goes Official: New Powerful Mobile Chipset For Value Flagships

Qualcomm Snapdragon 780G Vs MediaTek Dimensity 8200 5G: Final Verdict

In conclusion, both the Snapdragon 780G and Dimensity 8200 5G are powerful chipsets that offer excellent performance for future-ready gaming. While the Snapdragon 780G may have a slight edge in CPU and memory performance, the Dimensity 8200 5G’s superior GPU and image processing capabilities make it the better choice for gaming and multimedia applications. Ultimately, the choice between these two chipsets depends on the user’s specific needs and preferences.

Also Read: MediaTek Dimensity 8200 VsQualcomm Snapdragon 870: Best 5G Chipset For Value Flagships